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Pressure
Freescale Semiconductor 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
The MPX2053 series devices are silicon piezoresistive pressure sensors that provide a highly accurate and linear voltage output directly proportional to the applied pressure. A single, monolithic silicon diaphragm with the strain gauge and an integrated thin-film resistor network. Precise span and offset calibration with temperature compensation are achieved by laser trimming.
MPX2053 Rev 7, 10/2008
MPX2053 Series
0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale (Typical)
Features
* * * * * * Temperature Compensated Over 0C to +85C Easy-to-Use Chip Carrier Package Options Ratiometric to Supply Voltage Gauge Ported and Non Ported Options Available in Easy-to-Use Tape & Reel Differential and Gauge Pressure Options ORDERING INFORMATION
Device Name Case No. None # of Ports Single Dual Gauge
Application Examples
* * * * * * Pump/Motor Control Robotics Level Detectors Medical Diagnostics Pressure Switching Blood Pressure Measurement
Pressure Type Differential
Absolute
Device Marking
Small Outline Package (MPXV2053G Series) MPXV2053GP 1369 MPXV2053DP 1351 MPXV2053GVP 1368 Unibody Package (MPX2053 Series) MPX2053D 344 * MPX2053DP 344C MPX2053GP 344B MPAK Package (MPXM2053 Series) MPXM2053D 1320 * MPXM2053DT1 1320 * MPXM2053GS 1320A MPXM2053GST1 1320A
* * *
* * * * * * * *
MPXV2053GP MPXV2053DP MPXV2053GV MPX2053D MPX2053DP MPX2053GP MPXM2053D MPXM2053D MPXM2053GS MPXM2053GS
* *
* *
* *
(c) Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX2053D CASE 344-15
MPX2053GP CASE 344B-01
MPX2053DP CASE 344C-01
SMALL OUTLINE PACKAGES
MPXV2053GP CASE 1368-01
MPXV2053GP CASE 1369-01
MPXV2053DP CASE 1351-01
MPAK PACKAGES
MPXM2053D/DT1 CASE 1320-02
MPXM2053GS/GST1 CASE 1320A-02
MPX2053 Sensors Freescale Semiconductor 2
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range(1) Supply Voltage Supply Current Full Scale Span Offset(4) Sensitivity Non-Linearity Pressure Hysteresis (0 to 50 kPa) Temperature Hysteresis (-40 to 125C) Temperature Coefficient of Full Scale Temperature Coefficient of Offset Input Impedance Output Impedance Response Time(5) (10% to 90%) Warm-Up Time Offset Stability(6) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
(3) (2)
Symbol POP VS IO VFS -- -- -- -- -- TCVFS TCVOFF ZIN ZOUT tR -- --
Min 0 -- -- 38.5 -1.0 V/P -0.6 -- -- -2.0 -1.0 1000 1400 -- -- --
Typ -- 10 6.0 40 -- -- -- 0.1 0.5 -- -- -- -- 1.0 20 0.5
Max 50 16 -- 41.5 1.0 0.8 0.4 -- -- 2.0 1.0 2500 3000 -- -- --
Units kPa VDC mAdc mV mV -- %VFS %VFS %VFS %VFS mV ms ms %VFS
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Supply Voltage Pressure (P1 > P2) Storage Temperature Operating Temperature Range Max Value 16 200 -40 to +125 -40 to +125 Unit V kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2053 Sensors Freescale Semiconductor 3
Pressure
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 3 Thin Film Temperature Compensation and Calibration
X-ducer Sensing Element
2 4
Vout+ Vout-
1 GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side relative to the vacuum side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum side relative to the pressure side.
On-Chip Temperature Compensation and Calibration
Figure 2 shows the minimum, maximum and typical output characteristics of the MPX2053 series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
40 35 Output (mVdc) 30 25 20 15 10 5 0 -5 0
VS = 10 Vdc TA = 25C TYP MAX SPAN RANGE (TYP) MIN
kPa PSI
12.5 1.8
25 3.6
37.5 5.4
50 7.25
OFFSET (TYP)
Figure 2. Output vs. Pressure Differential
MPX2053 Sensors Freescale Semiconductor 4
Pressure
LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 3) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. The specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
Least Squares Fit Exaggerated Performance
Relative Voltage Output
Least Square Deviation
Straight Line
End Point Straight Line Fit
OFFSET 0 50 Pressure (% Full scale) 100
Figure 3. Linearity Specification Comparison
Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2053 series pressure sensor operating characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Refer to application note AN3728, for more information regarding media compatibility.
Silicone Die Coat Wire Bond
Die P1
Stainless Steel Metal Cover Epoxy Case
Lead Frame P2
RTV Die Bond
Figure 4. Unibody Package -- Cross-Sectional Diagram (Not to Scale)
MPX2053 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
C R M
1
B
-AN
PIN 1
1234
2
3
4
Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00
L
-TJ
SEATING PLANE
G F
M
F Y
D 4 PL 0.136 (0.005)
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE AA UNIBODY PACKAGE
SEATING PLANE
-TR H N
PORT #1 POSITIVE PRESSURE (P1)
-AU L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC
-Q-
B
12 34
PIN 1
K
S
-P0.25 (0.010) J C
M
TQ
S
F G D 4 PL 0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT
CASE 344B-01 ISSUE B UNIBODY PACKAGE
MPX2053 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
V R
PORT #2 PORT #1
-AU W H N
PORT #2 VACUUM (P2)
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38
PORT #1 POSITIVE PRESSURE (P1)
-QSEATING PLANE
B
SEATING PLANE
PIN 1
1234
-P-TJ C -T0.25 (0.010)
M
K S
TQ
S
F G D 4 PL
0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B UNIBODY PACKAGE
MPX2053 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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PAGE 1 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1320-02 ISSUE B
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320-02 ISSUE B
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PACKAGE DIMENSIONS
PIN 4
PIN 1
PAGE 1 OF 2
CASE 1320A-02 ISSUE A
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320A-02 ISSUE A
MPX2053 Sensors Freescale Semiconductor 15
PACKAGE DIMENSIONS
CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT
MPX2053 Sensors Freescale Semiconductor 16
PACKAGE DIMENSIONS
CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT
MPX2053 Sensors Freescale Semiconductor 17
PACKAGE DIMENSIONS
CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT
MPX2053 Sensors Freescale Semiconductor 18
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MPX2053 Rev. 7 10/2008

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